Tungsten copper alloy is a pseudo-alloy of copper and tungsten.tungsten copper parts As copper and tungsten are not mutually soluble, the material is composed of distinct particles of one metal dispersed in a matrix of the other one. The microstructure is therefore rather a metal matrix composite than a true alloy.The alloy combines the properties of both metals, resulting in a material that is heat-resistant, ablation-resistant, highly thermally and electrically conductive, and easy to machine.
Tungsten Copper Properties?
Copper tungsten alloys are a used in a wide variety of applications including heat sinks in electrical devices, resistance welding, electrical contacts and machining where the alloy is used as an arc contact. The alloy properties are dependent on the mixture of the copper and tungsten alloy. Typically, higher levels of copper are used in jobs in which thermal and electrical conductivity is more critical and higher levels of tungsten are used when strength and hardness are needed.
Tungsten Copper Machining?
The melting point of tungsten, copper vary greatly higher than the boiling point of the copper melting point of tungsten and tungsten copper immiscible, the general method of smelting is difficult to produce tungsten copper alloy, the only powder metallurgy to make tungsten copper composites manufacturing to become a reality. The method of preparation is mainly divided into two categories: infiltration and direct sintering method. In recent years, due to the rapid development of nanotechnology, directly obtained by sintering a great development.
Tungsten copper rod is a kind of round rod. The grade of tungsten copper rod include WD10070、WD10075 and WD10080. the choice of tungsten copper content are depend of the application of tungsten copper rod, but if you do not know the detail application of the material, you can choice the content according to GB/T8320-2003. Tungsten copper rod is a kind of composite material, which is manufactured by high-purity tungsten powder and high conductivity copper powder with the production process of isostatic pressing, sintering temperature and copper infiltrated.
What is Tungsten Copper Plate?
Tungsten copper plate is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Metals (Kovar), etc. The products are widely application in the fields such as radio frequency, microwave, high power diode packaging and optical communication system.
What Is Tungsten Copper Bar?
Tungsten copper bar is composite by tungsten and copper, which owns the properties of both tungsten and copper.
Tungsten copper electrode is a kind of tungsten copper products, which are also called copper tungsten electrode, tungsten copper alloy electrode. And the tungsten copper electrode are owns the both advantages of tungsten and copper. Tungsten copper electrodes include EDM electrode, high-voltage electrode discharge tube and electronic packaging materials.
What is Tungsten Copper Contact?
Tungsten copper contacts are subjected to extreme mechanical and thermal stresses during operation. For fractions of a second, temperatures rise to several thousand degrees as a result of the arcing. Our tungsten copper alloy electrode materials are used because of tungsten copper alloy electrode unique physical properties. Tungsten copper alloy electrode material offered by us is high quality. We can provide all kinds of tungsten copper electrode as your requirements. Tungsten copper electrode is easy to be machined.
What is Tungsten Copper Heat Sink?
Tungsten copper heat sink is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Metals (Kovar), etc. The products are widely application in the fields such as radio frequency, microwave, high power diode packaging and optical communication system.