Tungsten Copper Slab
Tungsten copper slab with the properties of tungsten’s high strength, high stiffness, low thermal expansion coefficient and copper’s high plasticity, good electrical and thermal conductivity and other properties. In large scale integrated circuits and high-power microwave devices, tungsten copper alloy material as the substrate, the slug, connectors and cooling components have developed rapidly. However, tungsten copper alloy sheet when used as electronic packaging materials, the density must be greater than 98% theoretical density, in order to ensure a high thermal conductivity, thus increasing the density of tungsten copper alloy tungsten copper alloy sheet is the key to performance guarantees.
Major existing technology tungsten copper slab processing includes the following:
(1) Hot forging + cold forging processing method; the method by forging machinery to exert pressure on tungsten-copper alloy billets, processing temperature higher than the recrystallization temperature of copper to produce plastic deformation in order to obtain a high-density alloy material, and then follow the product requirements again after forging at room temperature to give the desired material specifications.
(2) Hot + complex pressure finishing treatment method; this method is applied simultaneously sintered tungsten-copper alloy unidirectional pressure to give higher relative density of the alloy, then in order to achieve the desired size, and then the sintered alloy material is re-pressed.
(3) Multi-pressure hot-rolled + finishing treatment method; the method by recrystallization temperature higher than copper, to increase the density of the sintered alloy of tungsten copper alloy rolled on the hot strip mill, then according to the required size of the tungsten copper alloy re-pressed.
However, a closer analysis shows that the above processing method, the processing method of the prior tungsten copper alloys are a series of problems, first of all the issues involved is the production cycle is too long, generally two to three production processes to produce a thickness of less than 1mm tungsten copper alloy sheet, for example, at least in its production cycle over two to five days; the second is high energy consumption: hot forging, hot rolling, annealing and other processes required high-power high-temperature furnace, high energy consumption; and now art methods of low yield, at high temperatures can easily cracking scrap processing, production of tungsten copper alloy sheet thickness of 1mm for example, the integrated rate of about 50% finished; in addition, the prior art methods use large equipment investment the type and quantity more, and most of high power and large-tonnage processing equipment, requires larger processing site.
Analysis of the main reasons the prior art methods exist for each of the above is that many defects than a lower tungsten copper slab of plastic, when the deformation of its thermal processing, because the two strength, hardness, ductility and thermal expansion coefficient of tungsten copper phase differences, thermal processing is easy to produce plastic deformation uncoordinated, and generate interface cracking; while at the same time, when its cold deformation, the first tungsten copper alloy surface hardening by the force generated, with the increase driven by the strength of the internal surface of the force to improve its density, but when the surface by the force increases to its ultimate stress alloys will produce interface cracking; another point in that, when the tungsten-copper alloy used for electronic packaging materials, the thickness of the tungsten copper alloy material is thin, and the existing sintering the resultant alloy slabs generally thicker, its internal impurity element blank hard to restore completely removed by volatilization and hydrogen during the sintering process in the preparation of the slab, resulting in poor ductility, and thick slabs require multiple thermal processing steps to desired thickness, which also makes the slab in the process is easy to produce and cause hardening material cracking.
Methods to make tungsten copper alloy avoid thermal processing step, and a desired thickness can be obtained directly key is to overcome the deficiencies of the prior art through the cold, one of the technical issues are also skilled in the art to be solved.
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Tungsten Copper
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