Tungsten Copper Heat Sink Properties
Tungsten Copper Heat Sink Properties
Tungsten copper heat sink by adjusting the tungsten content and copper content, tungsten copper heat sink has its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc. For tungsten copper alloy heat sink owns high heat conductivity and low thermal expansion are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Surmounts, etc.
Tungsten Copper Heat Sink Advantages
The table gives tungsten copper heat sink properties below:
Commodity |
Tungsten Copper Heat Sink |
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Grade |
Tungsten Content |
Copper Content |
Density |
Heat Conductivity (W/M.K) |
Thermal Expansivity (10-6/K) |
W90Cu10 |
90±1 |
Balance |
17.0 |
180-190 |
6.5 |
W85Cu15 |
85±1 |
Balance |
16.3 |
190-200 |
7.0 |
W80Cu20 |
80±1 |
Balance |
15.6 |
200-210 |
8.3 |
W75Cu25 |
75±1 |
Balance |
14.9 |
220-230 |
9.0 |
W70Cu30 |
70±1 |
Balance |
14.2 |
230-240 |
9.8 |
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