Tungsten Copper W75 Heat Sink
Tungsten copper W75 heat sink is composed of 75% W and 25% Cu, which not only has high density (14.50g/cm3), high hardness (≥HB195), high strength, but also has good conductivity (%38IACS), softening temperature ≥900℃, thermal conductivity coefficient is between 200-230 (wm/k) and the coefficient of expansion is 9.0-9.5 (10-6k).
With the perfect arrangement of W and Cu, tungsten copper W75 heat sink provides a best way to solve the deformation in some small precision machining. And with the development of large scale integrated circuit and high power electronics, tungsten copper composite material has been widely used in electronics and heat sink materials.
Tungsten copper heat sink is mainly used for refrigeration, air conditioning systems and automotive radiators (heat exchangers). Besides, it also can be used in thermal management of electronic products, such as the computer central processing unit (CPU) or graphics processor. And it is conductive to cooling of electrons and optoelectronic devices such as high power lasers and light emitting diodes (LED), whose physical design facilitates the cooling of the surrounding fluid, increases the surface area of air contact.
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