Tungsten Copper Heat Sink Feature
Tungsten Copper Heat Sink Feature
| Grade | Composite | Properties | |||
| material | Contentwt-% | Densityg/cm3 | CTEppm/K | Electricity conductivity | |
| W90Cu | WCu | 90±1余 | 17.0 | 6.5 | 180～190W/m.K |
| W85Cu | WCu | 85±1余 | 16.3 | 7.0 | 190～200W/m.K |
| W80Cu | WCu | 80±1余 | 15.7 | 8.3 | 200～210W/m.K |
| W75Cu | WCu | 75±1余 | 14.9 | 9.0 | 220～230W/m.K |
(1) Ceramic material: Al2O3(A-90, A-95, A-99) , BeO(B-95、B-99) , AlN etc.;
(2) Semiconductor materials: Si、GaAs,SiGe,SiC, InGaP, InGaAs, InAlGaAs, AlGaInP and AlGaAs etc.．
(3) Metallic materials: Kovar (4J29) , 42 alloy etc.;
Tungsten copper alloy, with high thermal conductivity and low coefficient of thermal expansion, which is widely used in high-power devices as heat sink. In recent years, domestic and foreign, many experts are keen on to the tungsten copper used for heat sink,. which include the powder modified to add the active agent in order to improve the sintered density of tungsten and copper. With the development of high-power electronic devices and large-scale integrated circuits, the proposed upgrading of the requirements of the appropriate materials with silicon, tungsten-copper composite material has high heat resistance and good thermal conductivity, and gallium arsenide, and ceramic materials to match the thermal expansion coefficient, tungsten copper has become the new electronics packaging and heat sink materials.
At present, the density of the tungsten copper can be up to 99% , which is used by high purity powders of raw materials, the thermal conductivity of W-15Cu materials up to 200W / (m • k). As electronic packaging and heat sink materials have higher requirements for quality and performance of the tungsten-copper materials, the requirement is not only high purity but also should be uniform, low air leakage, thermal conductivity and good thermal expansion coefficient is small, strictly control the production process and product quality is needed.Any feedback or inquiry of Tungsten Copper Alloy Products please feel free to contact us:
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