Tungsten has a high melting point, high density, low thermal expansion coefficient and high strength, the copper has good thermal conductivity. Tungsten-copper composite material due to a combination of tungsten and copper and many other fine features (such as high melting point of tungsten, low linear expansion coefficient and high strength, good electrical conductivity and thermal conductivity of copper), and has good thermal conductivity, corrosion resistance arc , welding resistance and high temperature resistance and oxidation resistance, is now widely used in electrical, electronic, mechanical, metallurgical and other industries.

Tungsten Copper Rod Sintering Method As Following

At 1 083 ℃, while the activity of copper nanoparticles high melting point of copper, large surface area, the melting point down to about 500 ℃. First heating rate of 5 ℃ / min of the experiment was heated to 650 ℃ (Group A pressure during sintering 4t, group B pressurized 6t), then the heating rate is still 5 ℃ / min was heated to 900 ℃; to prevent sample cracking and protect the mold, then the sample is reduced to a pressure group A 2t, group B sample pressure is reduced to a total of 4t then incubated for two hours. Finally, the specimen was removed from the mold and sintered under no pressure to 5 ℃ / min of heating rate to the set temperature, and incubated for several hours, and then the sample was cooled in the furnace to room temperature.

As the sintering temperature increases, the density of tungsten copper higher. This is because the wetting angle between the tungsten and copper is small, limiting the mobility of liquid copper, the pores can not completely eliminate, thereby to raise the sintering temperature only to increase the density. Copper sintering tungsten grain size samples with sintering temperature has a tendency to increase, and even more uniform distribution of liquid copper, the greater density; and, as the temperature increases, the tungsten grains gradually grow Large grain polygons ball trend, copper phase also distributed more evenly, the greater density. This is because the powder during liquid phase sintering, mainly liquid phase flow deformation to fill the pores and improve densification. Below the melting point of Cu in solid phase sintering, and then the two phases mainly depend on the distribution of solid phase diffusion and migration performed, the process is very slow, difficult to fully filling the pores, making it difficult to improve the density.

Tungsten copper sintering method also includes the activation temperature liquid phase sintering and sintering method. Liquid phase sintering method is characterized by the activation of the production process is simple, but there is a high sintering temperature, sintering time is long, a large number of volatile copper, poor sintering performance, lower sintered density and other shortcomings, can not meet the requirements. Therefore, in order to improve the density of the material after the liquid phase sintering need to increase the post-treatment step associated multi-pressure, hot pressing, hot forging, etc., but it increases the complexity of the process, the application is limited. In addition, the high temperature liquid phase sintering process of discovery, tungsten, copper powder particle size also affects the sintered density tungsten-copper composite material, the finer the powder, the higher the density obtained by sintering.

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