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Tungsten Copper Submount

What is Tungsten Copper Submount

Tungsten copper submount is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Metals (Kovar), etc. The products are widely applicated in the fields such as radio frequency, microwave, high power diode packaging and optical communication system.

Tungsten Copper Submount Features

High thermal conductivity
Excellent hermeticity
Excellent size control, surface finish and flatness
Semi-finished or finished (Ni/Au plated) products available

Tungsten Copper Submount General Grade

Type	Composition		Properties
	Element	Content wt%	Density		CTE ppm/K	TC, W/m·K
			Mass density, g/cm3	Relative density, %T.D
W90Cu	WCu	90±1balance	17.0	≥99	5.6~6.5	180~190
W85Cu	WCu	85±1balance	16.3	≥99	6.3~7.0	190~200
W80Cu	WCu	80±1balance	15.4	≥99	7.6~9.1	200~220

Any feedback or inquiry of Tungsten Copper Alloy Products please feel free to contact us:
Email: sales@chinatungsten.com
Tel.: +86 592 512 9696 ; +86 592 512 9595
Fax.: +86 592 512 9797