Tungsten Copper Plate Sintering Method

Tungsten Copper Plate Sintering Method

The sintering method of tungsten copper plate are different with the method of tungsten copper sheet, due to the thickness of the tungsten copper plate is much larger than tungsten copper sheet. Therefore, when the sintering method to grasp in order to achieve the best effect sintering.
Compared with the high-temperature liquid-phase sintering, liquid phase sintering activation product performance is relatively good. Therefore, in order to improve the performance of tungsten copper, tungsten copper sintering method using activated liquid phase sintering, compared with the high-temperature liquid-phase sintering method, which not only reduces the sintering temperature and shortening the sintering time and the sintering density is greatly increased.

The following describes two kinds of tungsten copper plate activated liquid phase sintering process:
1, W powder, Cu powder and a small amount of Ni, Co or Fe powder additive heptane after drying 24h in a ball mill and sieved, and then by press-forming, and finally the protection of the H2, sintered at 1250 ~ 1400 ℃ 1h conditions.
2, W powder milled in heptane after 24h drying sieved and added to the salt solution and the salt solution of Cu Ni, Co or Fe are additive mixture, after stirring at 95 ℃ conditions, evaporation, and then followed by crushing, H2 reduction under the protection of 800 ℃ 1h, press molding, and finally protection in H2, 1h sintering conditions under 1250 ~ 1400 ℃.

Tungsten copper plate liquid phase sintering of tungsten copper alloy can get a higher relative density, hardness, flexural strength and other properties. Ms. Huang and so will be less than 1% of Co added to the original copper tungsten powder mixed in vivo, significantly improved the performance of the final proceeds of tungsten copper composite. Another study also confirms the activation properties within a certain range with increasing amount of added activator increases. Add Fe or Co, tungsten-copper composite density, strength and hardness in the range of 0.35% to 0.5% have experienced the best value. But it is worth noting that adding activator can affect high conductivity copper phase electrical and thermal conductivity, thereby significantly reducing the thermal conductivity of the material, which is detrimental to the requirements of high electrical and thermal conductivity of the material for microelectronics. Therefore, the material prepared by this method is only applicable to electrical conductivity, thermal conductivity is not critical.

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